Advanced Packaging, IC Assembly (Cleanroom ISO 7)
Microelectronics packaging technologies are in a state of transition. Product requirements are driving circuit designers to create smaller, faster and more reliable products.
AmTECH has the talent, expertise and technology to meet the most demanding requirements for aluminum wedge, gold wedge and gold ball wire bonding for Chip-On-Board (COB), Chip-On-Flex (COF), IC Assembly and other Advanced Packaging technologies.
AmTECH quick-turn prototype standard delivery is 5-days with optional 1, 2 or 3 days. Production can be schedule on a week-to-week or month-to-month basis to meet your specific schedule requirements.
IC Assembly
We offer quick-turn Prototype and low to medium volume Production for
IC Assembly.
- Ceramic Package Assembly: DIP, CQFP, LCC, CPGA, C-SOIC
- Plastic Package Assembly: QFN, QFP, SOIC, SSOP
- Lid Attach or Encapsulation: taped-lids, ceramic lids, combo lids, plastic lids, glob top (black opaque) or transparent encapsulation materials.
Chip-On-Board (COB) and Chip-On-Flex (COF)
PCB or PCF Assembly is done with a combination of lead-free SMT Technology, RoHS compliance Printed Circuit Board, components and assembly processes prior to Die Attach, Wire Bond and Encapsulation of bare die.
AmTECH’s Advanced Packaging, IC Assembly capabilities:
- IC Assembly (Ceramic or Plastic Packages)
- Chip-On-Board (COB) and Chip-On-Flex (COF)
- System-in-Package (SiP) and Multichip Modules (MCM)
- Die Attach: Conductive, non-conductive, thermally conductive epoxies
- Aluminum wedge and gold wedge wire bonding. (45um pitch)
- Gold ball wire bonding
- Wires up to 7.5mm (0.3") long with Al or Au wire
- Loops as low as 75um (0.003”)
- Large wire bonding work area 300 mm x 200 mm (12.0” x 8.0”)
- XRAY of gold wire bonding.
- PCB thickness from 0.010” to 0.100” (0.25mm to 2.5mm)
- RF and Microwave devices/ Camera Modules / Fiber Optics
- Cleanroom, MIL-STD-883
AmTECH’s main focus is to meet all customer expectations including excellent communication, superior service, on-time delivery and a strong commitment to quality.