AmTECH Micro, PCB Assembly and Advanced Packaging

Welcome to AmTECH

Your NPI Manufacturing Solution!

Phone (408) 227-8885. Email: info@amtechmicro.com

SMT | BGA | XRAY | AOI | IC Assembly | COB | COF | SiP | MCM | Wire Bonding

Printed Circuit Board Assembly - PCBA

Printed Circuit Board Assembly - PCBAAmTECH is a Silicon Valley provider of Electronics Manufacturing Services for Telecommunications, Defense, Medical, Aerospace and Automobile industries.

AmTECH balances high quality standards with fast, smooth production. Normal lead times being less than 5-days and – expedited – 1, 2 or 3 days delivery.  Flexibility is vital and production schedules are always subject to short notice change.

Besides providing PCB Assembly Services for its customers, AmTECH provides expertise in the Advanced Packaging manufacturing services for electronic products requiring wire bonding in a Cleanroom environment.

Surface Mount Technology - SMT

AmTECH has advanced, state-of-the-art equipment and technology designed for speed, accuracy and flexibility.  We have capabilities to place everything from 01005 and 0201 passive components to large BGAs, uBGAs, CSPs, fine pitch QFNs, and connectors.

New jobs are set up offline and once Pick & Place and AOI programs are optimized, data is centrally stored to guarantee the correct program and vision information is loaded each time; machines are easily optimized for products with up to 200 different line items.

In addition, AmTECH’s experienced Engineering team always develops a custom reflow profile for all RoHS compliance PCBA, reviews solder stencils in detail, and carefully develops any additional tooling or fixtures required to optimize the process for each individual assembly.

We respond quickly to customer needs:

  • Consignment quotes (labor only) 24-hours or less.
  • Turnkey quotes (material + labor) 5-days or less.

AmTECH’s Printed Circuit Board Assembly (PCBA) services:

Printed Circuit Board Assembly - PCBA
  • Lead-free SMT assembly (PCB fabrication, components and assembly processes)
  • High-mix PCB Assemblies
  • BGAs, uBGAs and CSPs
  • 01005, 0201 through 0.4 mm pitch QFNs, QFPs and connectors.
  • Aluminum wedge, gold wedge and gold ball wire bonding.
  • XRAY and AOI (Automated Optical Inspection)
  • PCB thickness from 0.016” to 0.160” (0.4mm to 4mm)
  • RF and Microwave Assemblies
  • Camera Modules for the Telecommunications industry.
  • Fiber Optic Transceivers
  • IPC-A-610, Class 2 and Class 3 – All quality personnel certified.

AmTECH provides local, on-site Manufacturing, Engineering,
quick-turn Prototype, and low to medium volume Production.

 

 

 

6541 Via Del Oro, San Jose, CA 95119. Phone (408) 227-8885. Email: info@amtechmicro.com
©2009 AmTECH Microelectronics, Inc. All rights reserved.