AmTECH Micro, PCB Assembly and Advanced Packaging

Welcome to AmTECH

Your NPI Manufacturing Solution!

Phone (408) 227-8885. Email: info@amtechmicro.com

SMT | BGA | XRAY | AOI | IC Assembly | COB | COF | SiP | MCM | Wire Bonding

Quick-Turn Prototype, NPI (New Product Introduction)

AmTECH provides local, on-site Manufacturing, Engineering, quick-turn Prototype, and low to medium volume Production.

We respond quickly to customer needs:

  • Consignment quotes (labor only) 24-hours or less.
  • Turnkey quotes (material + labor) 5-days or less.
  • Standard delivery 5-days with optional 1, 2 or 3 days.
  • Local, on-site Manufacturing, Engineering and Material Logistics.
  • Advanced, state-of-the-art technology.
  • Streamlined prototyping process, excellent service, on-time delivery and a commitment to quality.
  • We combine advanced processes with highly skilled resources. Our innovative techniques extend to sophisticated packaging and assembly technology.
  • Time-to-market focus.

AmTECH’s Advanced Packaging, IC Assembly capabilities: (Cleanroom ISO 7)

  • IC Assembly (Ceramic or Plastic Packages)
  • Ceramic Package Assembly: DIP, CQFP, LCC, CPGA, C-SOIC
  • Plastic Package Assembly: QFN, QFP, SOIC, SSOP
  • Chip-On-Board (COB) and Chip-On-Flex (COF)
  • System-in-Package (SiP) and Multichip Modules (MCM)
  • Die Attach: conductive, non-conductive, thermally conductive epoxies
  • Aluminum wedge and gold wedge wire bonding (45um pitch)
  • Gold ball wire bonding
  • Wires up to 7.5mm (0.3") long with Al or Au wire
  • Loops as low as 75um (0.003”)
  • Large wire bonding work area 300 mm x 200 mm (12.0” x 8.0”)
  • XRAY of gold wire bonding.
  • PCB thickness from 0.010” to 0.100” (0.25mm to 2.5mm)
  • RF and Microwave devices/ Camera Modules / Fiber Optics
  • Cleanroom, MIL-STD-883

AmTECH’s Printed Circuit Board Assembly (PCBA) services:

  • Lead-free SMT assembly (PCB fabrication, components and assembly processes)
  • High-mix PCB Assemblies
  • BGAs, uBGAs and CSPs
  • 01005, 0201 through 0.4 mm pitch QFNs, QFPs and connectors.
  • XRAY and AOI (Automated Optical Inspection)
  • PCB thickness from 0.016” to 0.160” (0.4mm to 4mm)
  • RF and Microwave Assemblies
  • Camera Modules for the Telecommunications industry.
  • Fiber Optic Transceivers
  • IPC-A-610, Class 2 and Class 3 – All quality personnel certified

6541 Via Del Oro, San Jose, CA 95119. Phone (408) 227-8885. Email: info@amtechmicro.com
©2009 AmTECH Microelectronics, Inc. All rights reserved.